Model Number & Core Frequency: X4 965 / 3.4GHz (Black Edition)
OPN: HDZ965FBK4DGM (“M” indicates new revision)
L1 Cache Sizes: 64K of L1 instruction and 64K of L1 data cache per core (512KB total L1 per processor)
L2 Cache Sizes: 512KB of L2 data cache per core (2MB total L2 per processor)
L3 Cache Size: 6MB (shared between cores)
Total Cache (L2+L3): 8MB
Memory Controller Type:ype: Integrated 128-bit wide memory controller*
Memory Controller Speed: Up to 2.0GHz with Dual Dynamic Power Management
Types of Memory Supported:
PC2-8500 / DDR2-1066MHz
PC3-10600 / DDR3-1333MHz
HyperTransport 3.0 Link: One 16-bit/16-bit link @ up to 4.0GHz full duplex (2.0GHz x2)
Total Processor Bandwidth: Up to 37.3 GB/s total bandwidth
Packaging: Socket AM3 938-pin organic micro pin grid array (micro-PGA)
Fab location: GLOBALFOUNDARIES Fab 1 module 1 in Dresden, Germany (formerly AMD Fab 36)
Process Technology: 45-nanometer DSL SOI (silicon-on-insulator) technology
Approximate Transistor count: ~ 758 million (45nm)
Approximate Die Size: 258 mm² (45nm)
Max Temp: 62° Celsius
Nominal Voltage: 0.875 - 1.4 Volts
Max TDP: 125 Watts