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Specifications
Processor Number 326
# of Cores 1
Clock Speed 2.53 GHz
L2 Cache 256 KB
FSB Speed 533 MHz
FSB Parity No
Instruction Set 64-bit
Embedded Options Available No
Lithography 90 nm
Max TDP 84 W
VID Voltage Range 1.250V-1.400V

Memory Specifications
Physical Address Extensions 32-bit
ECC Memory Supported No

Package Specifications
TCASE 67.7°C
Package Size 37.5mm x 37.5mm
Processing Die Size 112 mm2
# of Processing Die Transistors 125 million
Sockets Supported PLGA478, PLGA775
Low Halogen Options Available See MDDS

Advanced Technologies
Intel® Turbo Boost Technology No
Intel® Hyper-Threading Technology No
Intel® Virtualization Technology (VT-x) No
Intel® 64 Yes
Idle States Yes
Enhanced Intel SpeedStep® Technology No
Intel® Demand Based Switching No